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• Author : Satish Kandlikar,Srinivas Garimella,Dongqing Li,Stephane Colin,Michael R. King
• Publisher :Unknown
• Release Date :2013-10-25
• Total pages :592
• ISBN : 9780080983516

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Summary : Heat exchangers with minichannel and microchannel flow passages are becoming increasingly popular due to their ability to remove large heat fluxes under single-phase and two-phase applications. Heat Transfer and Fluid Flow in Minichannels and Microchannels methodically covers gas, liquid, and electrokinetic flows, as well as flow boiling and condensation, in minichannel and microchannel applications. Examining biomedical applications as well, the book is an ideal reference for anyone involved in the design processes of microchannel flow passages in a heat exchanger. Each chapter is accompanied by a real-life case study New edition of the first book that solely deals with heat and fluid flow in minichannels and microchannels Presents findings that are directly useful to designers; researchers can use the information in developing new models or identifying research needs

• Author : Satish Kandlikar,Srinivas Garimella,Dongqing Li,Stephane Colin,Michael R. King
• Publisher :Unknown
• Release Date :2006
• Total pages :450
• ISBN : 0080445276

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Summary : &Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.

• Author : Satish Kandlikar,Srinivas Garimella,Dongqing Li,Stephane Colin,Michael R. King
• Publisher :Unknown
• Release Date :2005-11-18
• Total pages :450
• ISBN : 0080456189

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Summary : Heat exchangers with minichannel and microchannel flow passages are becoming increasingly popular because of their ability to remove large heat fluxes under single-phase and two-phase applications. Heat Transfer and Fluid Flow in Minichannels and Microchannels serves as a sourcebook for those individuals involved in the design processes of microchannel flow passages in a heat exchanger. This book manages to present its findings in a manner that is directly useful to a designer, while a researcher is able to use the information in developing new models, or in identifying research needs Each chapter is accompanied by a ‘real life' case study First book published solely dealing with heat and fluid flow in minichannels and microchannels

• Author : L. P. Yarin,A. Mosyak,G. Hetsroni
• Publisher :Unknown
• Release Date :2008-09-19
• Total pages :481
• ISBN : 9783540787556

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Summary : The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transfer in systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems.

• Author : Salim Newaz Kazi
• Publisher :Unknown
• Release Date :2015-07-29
• Total pages :406
• ISBN : 9789535121466

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Summary : In the wake of energy crisis due to rapid growth of industries, the efficient heat transfer could play a vital role in energy saving. Industries, household equipment, transportation, offices, etc., all are dependent on heat exchanging equipment. Considering this, the book has incorporated different chapters on heat transfer phenomena, analytical and experimental heat transfer investigations, heat transfer enhancement and applications.

• Author : S. Mostafa Ghiaasiaan
• Publisher :Unknown
• Release Date :2007-10-22
• Total pages :229
• ISBN : 9781139468909

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Summary : This text is an introduction to gas-liquid two-phase flow, boiling and condensation for graduate students, professionals, and researchers in mechanical, nuclear, and chemical engineering. The book provides a balanced coverage of two-phase flow and phase change fundamentals, well-established art and science dealing with conventional systems, and the rapidly developing areas of microchannel flow and heat transfer. It is based on the author's more than 15 years of teaching experience. Instructors teaching multiphase flow have had to rely on a multitude of books and reference materials. This book remedies that problem by covering all the topics essential for a graduate course. Important areas include: two-phase flow model conservation equations and their numerical solution; condensation with and without noncondensables; and two-phase flow, boiling, and condensation in mini and microchannels.

• Author : R. K. Shah,A. L. London
• Publisher :Unknown
• Release Date :2014-06-28
• Total pages :492
• ISBN : 9781483191300

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Summary : Laminar Flow Forced Convection in Ducts is a sourcebook for compact heat exchanger analytical data. This book describes the analytical solutions for laminar fluid flow and forced convection heat transfer in circular and noncircular pipes, including applicable differential equations and boundary conditions involving velocity and temperature problems of fluid flow. The book also discusses fluid flow—how much power is required to pump fluids through the heat exchanger, as well as the heat transfer—the determination of q" distribution, and the temperature of fluid and walls. The text also analyzes the coolant or heat transfer fluid flows in a nuclear power reactor composed of a bundle of circular section fuel rods located inside a round tube. R.A. Axford addresses fluid flow and heat transfers results for the rod bundle geometry in "Heat Transfer in Rod Bundles." The book also provides an overview and guidelines that can be used for the designer and the applied mathematician. This book is suitable for engineers working in electronics, aerospace, instrumentation, and biomechanics that use cooling or heating exchanges or solar collection systems.

• Author : Viral Vinodray Dharaiya
• Publisher :Unknown
• Release Date :2011
• Total pages :184
• ISBN : OCLC:729432080

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Summary : "Deviations in heat transfer predictions by classical theory for single-phase laminar flow in microchannels have been mainly attributed to surface roughness, deviations in channel dimensions, errors in measurement, entrance and exit effects. Identifying correct thermal boundary conditions in a given application also plays an important role in accurate estimation of heat transfer coefficients. Different thermal boundary conditions generally applied in fluid domain are: T, H1, and H2. However, there are very few solutions available for the heat transfer under the H2 boundary condition which is the most applicable thermal boundary condition in many microchannel heat exchangers. The current work aimed at addressing two outstanding issues in this field: (i) predicting heat transfer rate in rectangular channels under H2 boundary conditions, and (ii) numerically studying the effects of structured roughness on pressure drop and heat transfer. A numerical model is developed to predict accurate fluid flow and heat transfer effects in microchannels under H2 boundary condition. Numerical data sets are generated for rectangular microchannels with different heated wall configurations. Although the results are seen as relevant in microscale applications, they are applicable to any sized channels. Based on the numerical results obtained for a wide range of aspect ratios, generalized correlations for fully developed laminar Nusselt number as a function of channel aspect ratio are presented for all the cases. This information can provide better understanding and insight into the transport processes in the microchannels. Surface roughness effects in conventional ducts are minimal whereas for the micro-sized channel, the roughness effects needs to be taken into account for laminar flow. Developing a better insight of the fundamental effects of surface roughness in parallel plate microchannels is therefore essential. Based on various roughness characterization schemes, the effect of structured roughness elements for incompressible laminar fluid flow is analyzed and the proposed numerical model is extended to accurately predict the pressure drop and heat transfer coefficient in presence of roughness using CFD software, FLUENT. The results are compared with the available experimental data for some of the rough surfaces."--Abstract.

• Author : Fang Lin Luo,Hong Ye,Muhammad H. Rashid
• Publisher :Unknown
• Release Date :2010-07-20
• Total pages :464
• ISBN : 9780080459028

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Summary : The purpose of this book is to describe the theory of Digital Power Electronics and its applications. The authors apply digital control theory to power electronics in a manner thoroughly different from the traditional, analog control scheme. In order to apply digital control theory to power electronics, the authors define a number of new parameters, including the energy factor, pumping energy, stored energy, time constant, and damping time constant. These parameters differ from traditional parameters such as the power factor, power transfer efficiency, ripple factor, and total harmonic distortion. These new parameters result in the definition of new mathematical modeling: • A zero-order-hold (ZOH) is used to simulate all AC/DC rectifiers. • A first-order-hold (FOH) is used to simulate all DC/AC inverters. • A second-order-hold (SOH) is used to simulate all DC/DC converters. • A first-order-hold (FOH) is used to simulate all AC/AC (AC/DC/AC) converters. * Presents most up-to-date methods of analysis and control algorithms for developing power electronic converters and power switching circuits * Provides an invaluable reference for engineers designing power converters, commercial power supplies, control systems for motor drives, active filters, etc. * Presents methods of analysis not available in other books.

• Author : Mubashir Gulzar
• Publisher :Unknown
• Release Date :2018-03-30
• Total pages :147
• ISBN : 9789811082948

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Summary : This thesis investigates the tribological viability of bio-based base stock to which different nanoparticles were incorporated for engine piston-ring–cylinder-liner interaction. It determines experimentally the effects of lubricating oil conditions (new and engine-aged) on the friction and wear of the materials used for piston rings and cylinder liners. The specific base stock examined was a trimethylolpropane (TMP) ester derived from palm oil, and the nanoparticles were used as additives to obtain tribologically enhanced bio-based lubricants. The overall analysis of the results demonstrated the potential of nanoparticles to improve the tribological behavior of bio-based base stock for piston-ring–cylinder-liner interaction.

• Author : Sujoy Kumar Saha,Manvendra Tiwari,Bengt Sundén,Zan Wu
• Publisher :Unknown
• Release Date :2016-04-23
• Total pages :129
• ISBN : 9783319294803

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Summary : This Brief addresses the phenomena of heat transfer enhancement. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to three other monographs including “Critical Heat Flux in Flow Boiling in Microchannels,” this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.

• Author : S. M. Sohel Murshed
• Publisher :Unknown
• Release Date :2016-06-15
• Total pages :182
• ISBN : 9789535124054

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Summary : Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.

• Author : S. Kakaç,L.L. Vasiliev,Y. Bayazitoglu,Y. Yener
• Publisher :Unknown
• Release Date :2006-05-20
• Total pages :509
• ISBN : 9781402033612

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Summary : This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.

• Author : John R Thome
• Publisher :Unknown
• Release Date :2018-05-18
• Total pages :1372
• ISBN : 9789813234383

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Summary : Set IV is a new addition to the previous Sets I, II and III. It contains 23 invited chapters from international specialists on the topics of numerical modeling of pulsating heat pipes and of slug flows with evaporation; lattice Boltzmann modeling of pool boiling; fundamentals of boiling in microchannels and microfin tubes, CO2 and nanofluids; testing and modeling of micro-two-phase cooling systems for electronics; and various special topics (flow separation in microfluidics, two-phase sensors, wetting of anisotropic surfaces, ultra-compact heat exchangers, etc.). The invited authors are leading university researchers and well-known engineers from leading corporate research laboratories (ABB, IBM, Nokia Bell Labs). Numerous 'must read' chapters are also included here for the two-phase community. Set IV constitutes a 'must have' engineering and research reference together with previous Sets I, II and III for thermal engineering researchers and practitioners.

• Author : Vincenzo Bianco,Oronzio Manca,Sergio Nardini,Kambiz Vafai
• Publisher :Unknown
• Release Date :2015-04-01
• Total pages :481
• ISBN : 9781482254020

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Summary : Nanofluids are gaining the attention of scientists and researchers around the world. This new category of heat transfer medium improves the thermal conductivity of fluid by suspending small solid particles within it and offers the possibility of increased heat transfer in a variety of applications. Bringing together expert contributions from across the globe, Heat Transfer Enhancement with Nanofluids presents a complete understanding of the application of nanofluids in a range of fields and explains the main techniques used in the analysis of nanofuids flow and heat transfer. Providing a rigorous framework to help readers develop devices employing nanofluids, the book addresses basic topics that include the analysis and measurements of thermophysical properties, convection, and heat exchanger performance. It explores the issues of convective instabilities, nanofluids in porous media, and entropy generation in nanofluids. The book also contains the latest advancements, innovations, methodologies, and research on the subject. Presented in 16 chapters, the text: Discusses the possible mechanisms of thermal conduction enhancement Reviews the results of a theoretical analysis determining the anomalous enhancement of heat transfer in nanofluid flow Assesses different approaches modeling the thermal conductivity enhancement of nanofluids Focuses on experimental methodologies used to determine the thermophysical properties of nanofluids Analyzes forced convection heat transfer in nanofluids in both laminar and turbulent convection Highlights the application of nanofluids in heat exchangers and microchannels Discusses the utilization of nanofluids in porous media Introduces the boiling of nanofluids Treats pool and flow boiling by analyzing the effect of nanoparticles on these complex phenomena Indicates future research directions to further develop this area of knowledge, and more Intended as a reference for researchers and engineers working in the field, Heat Transfer Enhancement with Nanofluids presents advanced topics that detail the strengths, weaknesses, and potential future developments in nanofluids heat transfer.

• Author : S.G. Kandlikar
• Publisher :Unknown
• Release Date :2019-01-22
• Total pages :784
• ISBN : 9781351442190

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Summary : Provides a comprehensive coverage of the basic phenomena. It contains twenty-five chapters which cover different aspects of boiling and condensation. First the specific topic or phenomenon is described, followed by a brief survey of previous work, a phenomenological model based on current understanding, and finally a set of recommended design equa

• Author : Sujoy Kumar Saha
• Publisher :Unknown
• Release Date :2015-09-27
• Total pages :356
• ISBN : 9780128043561

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Summary : Microchannel Heat transfer is the cooling application of high power density microchips in the CPU system, micropower systems and many other large scale thermal systems requiring effective cooling capacity. This book offers the latest research and recommended models on the microsize cooling system which not only significantly reduces the weight load, but also enhances the capability to remove much greater amount of heat than any of large scale cooling systems. A detailed reference in microchannel phase change (boiling and condensation) including recommended models and correlations for various requirements such as pressure loss, and heat transfer coefficient. Researchers, engineers, designers and students will benefit from the collated, state-of-the-art of the research put together in this book and its systematic, addressing all the relevant issues and providing a good reference for solving problems of critical analysis. Up-to-date information will help delineate further research direction in the microchannel heat transfer The latest modeling information and recommendations will help in design method and purpose

• Author : Libor Pekar
• Publisher :Unknown
• Release Date :2020-07-10
• Total pages :519
• ISBN : 9780128194232

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Summary : Advanced Analytic Control Techniques for Thermal Systems with Heat Exchangers presents the latest research on sophisticated analytic and control techniques specific for Heat Exchangers (HXs) and heat Exchanger Networks (HXNs), such as Stability Analysis, Efficiency of HXs, Fouling Effect, Delay Phenomenon, Robust Control, Algebraic Control, Geometric Control, Optimal Control, Fuzzy Control and Artificial Intelligence techniques. Editor Libor Pekař and his team of global expert contributors combine their knowledge and experience of investigated and applied systems and processes in this thorough review of the most advanced networks, analyzing their dynamics, efficiency, transient features, physical properties, performance, feasibility, flexibility and controllability. The structural and dynamic analyses and control approaches of HXNs, as well as energy efficient manipulation techniques are discussed, in addition to the design of the control systems through the full life cycle. This equips the reader with an understanding of the relevant theory in a variety of settings and scenarios and the confidence to apply that knowledge to solve problems in an academic or professional setting. Graduate students and early-mid career professionals require a robust understanding of how to suitably design thermal systems with HXs and HXNs to achieve required performance levels, which this book offers in one consolidated reference. All examples and solved problems included have been tried and tested, and these combined with the research driven theory provides professionals, researchers and students with the most recent techniques to maximize the energy efficiency and sustainability of existing and new thermal power systems. Analyses several advanced techniques, the theoretical background of these techniques and includes models, examples and results throughout Focusses on advanced analytic and control techniques which have been investigated or applied to thermal systems with HXs and HXNs. Includes practical applications and advanced ideas from leading experts in the field, as well as case studies and tested problems and solutions.

• Author : J. M. Ottino,Ottino J. M.
• Publisher :Unknown
• Release Date :1989
• Total pages :364
• ISBN : 0521368782

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Summary : This is the first book to present a unified treatment of the mixing of fluids from a kinematical viewpoint.

• Author : B. L. N. Kennett,H.-P. Bunge
• Publisher :Unknown
• Release Date :2018-03-01
• Total pages :444
• ISBN : 1108462731

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Summary : Geophysical Continua presents a systematic treatment of deformation in the Earth from seismic to geologic time scales, and demonstrates the linkages between different aspects of the Earth's interior that are often treated separately. A unified treatment of solids and fluids is developed to include thermodynamics and electrodynamics, in order to cover the full range of tools needed to understand the interior of the globe. The emphasis throughout the book is on relating seismological observations with interpretations of earth processes. Physical principles and mathematical descriptions are developed that can be applied to a broad spectrum of geodynamic problems. Incorporating illustrative examples and an introduction to modern computational techniques, this textbook is designed for graduate-level courses in geophysics and geodynamics. It is also a useful reference for practising Earth Scientists.

• Author : Ralph Remsburg
• Publisher :Unknown
• Release Date :2017-12-19
• Total pages :400
• ISBN : 9781351835916

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Summary : In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.