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Hermeticity of Electronic Packages
- Author : Hal Greenhouse
- Publisher :Unknown
- Release Date :2011
- Total pages :348
- ISBN : 9781437778779
Summary : This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package�especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to solve another. Thus, the book provides a ready reference to help deal with day to day issues as they arise. The book gathers in a single volume a great many issues previously available only in journals�or only in the experience of working engineers. How to define the ""goodness"" of a seal? How is that seal measured? How does the integrity of the seal affect circuit reliability? What is the significance of the measured integrity of the seal? What is the relationship of Residual Gas Analysis and the seal integrity? The handbook answers these questions and more, providing an analysis of nearly 100 problems representative of the wide variety of challenges that actually occur in industry today.
Handbook of Electronic Package Design
- Author : Michael Pecht
- Publisher :Unknown
- Release Date :2018-10-24
- Total pages :904
- ISBN : 9781351829977
Summary : Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Electronic Enclosures, Housings and Packages
- Author : Frank Suli
- Publisher :Unknown
- Release Date :2018-11-15
- Total pages :562
- ISBN : 9780081023914
Summary : Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. Introduces the concepts of materials recycling and sustainability to electronic enclosures Provides thorough coverage of all technical aspects relating to the design and manufacturing of electronic packaging Includes practical information on environmental considerations, shielding, standardization, materials selection, and more
Electronic Packaging and Production
- Author : Anonim
- Publisher :Unknown
- Release Date :1994
- Total pages :229
- ISBN : UIUC:30112004383946
Summary :
RF and Microwave Microelectronics Packaging
- Author : Ken Kuang,Franklin Kim,Sean S. Cahill
- Publisher :Unknown
- Release Date :2009-12-01
- Total pages :285
- ISBN : 1441909842
Summary : RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Advanced Electronic Packaging
- Author : William D. Brown,Richard K. Ulrich
- Publisher :Unknown
- Release Date :2006-02-24
- Total pages :812
- ISBN : STANFORD:36105114517258
Summary : This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed. W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses.
Microelectronics Packaging Handbook
- Author : R.R. Tummala,Eugene J. Rymaszewski,Alan G. Klopfenstein
- Publisher :Unknown
- Release Date :2012-12-06
- Total pages :720
- ISBN : 9781461540861
Summary : Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Electronic Packaging Materials Science III
- Author : Ralph Jaccodine,Kenneth A. Jackson,Robert C. Sundahl
- Publisher :Unknown
- Release Date :1988
- Total pages :479
- ISBN : UOM:39015026950629
Summary :
Hermeticity Testing of MEMS and Microelectronic Packages
- Author : Suzanne Costello,Marc P.Y. Desmulliez
- Publisher :Unknown
- Release Date :2013-10-01
- Total pages :200
- ISBN : 9781608075270
Summary : Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today’s package types. The authors cover the history and development of packaging, along with a view to understanding initial hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types.
Electronic Packaging and Interconnection Handbook 4/E
- Author : Charles A. Harper
- Publisher :Unknown
- Release Date :2005
- Total pages :1000
- ISBN : 0071430482
Summary : Whether you're designing an electronic system from scratch or engineering the project from someone else's design, the Handbook gives you the tools you need to get the job done faster, cheaper and more reliably than ever. We guarantee it. From development and design to manufacturing and testing, the Handbook has you covered. It's the one resource to turn to first. Why not put it to the test and see for yourself?
Electronic Packaging Materials Science
- Author : Anonim
- Publisher :Unknown
- Release Date :1995
- Total pages :229
- ISBN : UVA:X002682742
Summary :
Electronic packaging materials science VIII
- Author : Robert C. Sundahl
- Publisher :Unknown
- Release Date :1995-09-26
- Total pages :284
- ISBN : UCSD:31822021535380
Summary : The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Electronic Packaging and Interconnection Handbook
- Author : Charles A. Harper
- Publisher :Unknown
- Release Date :1997
- Total pages :900
- ISBN : UOM:39015040989835
Summary : Charles A. Harper's 2nd edition on designing and manufacturing all the major types of electronic systems is now double the size of the 1st edition. It draws upon the expertise of a dozen experts to make sense of this highly interdisciplinary field
Electronic Packaging and Corrosion in Microelectronics
- Author : Morris E. Nicholson
- Publisher :Unknown
- Release Date :1987
- Total pages :296
- ISBN : UOM:39015013827095
Summary :
Electronic Design
- Author : Anonim
- Publisher :Unknown
- Release Date :1968
- Total pages :229
- ISBN : UCSD:31822015729015
Summary :
5th Electronics Packaging Technology Conference
- Author : Mahadevan K. Iyer,Kok Chuan Toh
- Publisher :Unknown
- Release Date :2003
- Total pages :827
- ISBN : 0780382056
Summary :
Bibliography of Microelectronics and Electronics Packaging and Interconnection References (1986-1989)
- Author : John F. Graves,Annette M. Gigone-Graves
- Publisher :Unknown
- Release Date :1990-05
- Total pages :420
- ISBN : 0961715219
Summary :
Journal of Electronic Packaging
- Author : Anonim
- Publisher :Unknown
- Release Date :2008
- Total pages :229
- ISBN : UCSD:31822036937324
Summary :
Proceedings of the Technical Program
- Author : Anonim
- Publisher :Unknown
- Release Date :2002
- Total pages :229
- ISBN : UIUC:30112060354161
Summary :
Clinical Engineering
- Author : Yadin David,Wolf W. von Maltzahn,Michael R. Neuman,Joseph D. Bronzino
- Publisher :Unknown
- Release Date :2003-03-26
- Total pages :432
- ISBN : 0849318130
Summary : A volume in the Principles and Applications in Engineering series, Clinical Engineering focuses on managing the deployment of medical technology and integrating it appropriately with desired clinical practices. It provides a description of the wide range of responsibilities clinical engineers encounter, describes technology management and assessment in detail, and reviews the standards and regulatory agencies of interest. Then the book details various biomedical sensors, considering both biologic and electronic factors in sensor performance. Finally, the book covers bioinstrumentation, addressing traditional topics and recently developed instruments and devices such as pulse oximeters and home-care monitoring devices.
The International Journal of Microcircuits and Electronic Packaging
- Author : Anonim
- Publisher :Unknown
- Release Date :2000
- Total pages :229
- ISBN : UOM:39015048294980
Summary :