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Microjoining and Nanojoining

Microjoining and Nanojoining
  • Author : Y N Zhou
  • Publisher :Unknown
  • Release Date :2008-03-27
  • Total pages :832
  • ISBN : 9781845694043
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Summary : Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products. Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells. This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. Reviews the basics of nanojoining including solid-state bonding and fusion microwelding Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells

Solid-State Hydrogen Storage

Solid-State Hydrogen Storage
  • Author : Gavin Walker
  • Publisher :Unknown
  • Release Date :2008-09-30
  • Total pages :600
  • ISBN : 9781845694944
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Summary : Hydrogen fuel cells are emerging as a major alternative energy source in transportation and other applications. Central to the development of the hydrogen economy is safe, efficient and viable storage of hydrogen. Solid-state hydrogen storage: Materials and chemistry reviews the latest developments in solid-state hydrogen storage. Part one discusses hydrogen storage technologies, hydrogen futures, hydrogen containment materials and solid-state hydrogen storage system design. Part two reviews the analysis of hydrogen interactions including structural characterisation of hydride materials, neutron scattering techniques, reliably measuring hydrogen uptake in storage materials and modelling of carbon-based materials for hydrogen storage. Part three analyses physically-bound hydrogen storage with chapters on zeolites, carbon nanostructures and metal-organic framework materials. Part four examines chemically-bound hydrogen storage including intermetallics, magnesium hydride, alanates, borohydrides, imides and amides, multicomponent hydrogen storage systems, organic liquid carriers, indirect hydrogen storage in metal ammines and technological challenges in hydrogen storage. With its distinguished editor and international team of contributors, Solid-state hydrogen storage: Materials and chemistry is a standard reference for researchers and professionals in the field of renewable energy, hydrogen fuel cells and hydrogen storage. Assesses hydrogen fuel cells as a major alternative energy source Discusses hydrogen storage technologies and solid-state hydrogen storage system design Explores the analysis of hydrogen interactions including reliably measuring hydrogen uptake in storage materials

Advanced Piezoelectric Materials

Advanced Piezoelectric Materials
  • Author : Kenji Uchino
  • Publisher :Unknown
  • Release Date :2010-09-27
  • Total pages :696
  • ISBN : 9781845699758
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Summary : Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and their potential uses. Advanced piezoelectric materials: science and technology provides a comprehensive review of these new materials, their properties, methods of manufacture and applications. After an introductory overview of the development of piezoelectric materials, Part one reviews the various types of piezoelectric material, ranging from lead zirconate titanate (PZT) piezo-ceramics, relaxor ferroelectric ceramics, lead-free piezo-ceramics, quartz-based piezoelectric materials, the use of lithium niobate and lithium in piezoelectrics, single crystal piezoelectric materials, electroactive polymers (EAP) and piezoelectric composite materials. Part two discusses how to design and fabricate piezo-materials with chapters on piezo-ceramics, single crystal preparation techniques, thin film technologies, aerosol techniques and manufacturing technologies for piezoelectric transducers. The final part of the book looks at applications such as high-power piezoelectric materials and actuators as well as the performance of piezoelectric materials under stress. With its distinguished editor and international team of expert contributors Advanced piezoelectric materials: science and technology is a standard reference for all those researching piezoelectric materials and using them to develop new devices in such areas as microelectronics, optical, sound, structural and biomedical engineering. Provides a comprehensive review of the new materials, their properties and methods of manufacture and application Explores the development of piezoelectric materials from the historical background to the present status Features an overview of manufacturing methods for piezoelectric ceramic materials including design considerations

Joining and Assembly of Medical Materials and Devices

Joining and Assembly of Medical Materials and Devices
  • Author : Y N Zhou,M D Breyen
  • Publisher :Unknown
  • Release Date :2013-05-31
  • Total pages :574
  • ISBN : 9780857096425
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Summary : As medical devices become more intricate, with an increasing number of components made from a wide range of materials, it is important that they meet stringent requirements to ensure that they are safe to be implanted and will not be rejected by the human body. Joining and assembly of medical materials and devices provides a comprehensive overview of joining techniques for a range of medical materials and applications. Part one provides an introduction to medical devices and joining methods with further specific chapters on microwelding methods in medical components and the effects of sterilization on medical materials and welded devices. Part two focuses on medical metals and includes chapters on the joining of shape memory alloys, platinum (Pt) alloys and stainless steel wires for implantable medical devices and evaluating the corrosion performance of metal medical device welds. Part three moves on to highlight the joining and assembly of medical plastics and discusses techniques including ultrasonic welding, transmission laser welding and radio frequency (RF)/dielectric welding. Finally, part four discusses the joining and assembly of biomaterial and tissue implants including metal-ceramic joining techniques for orthopaedic applications and tissue adhesives and sealants for surgical applications. Joining and assembly of medical materials and devices is a technical guide for engineers and researchers within the medical industry, professionals requiring an understanding of joining and assembly techniques in a medical setting, and academics interested in this field. Introduces joining methods in medical applications including microwelding and considers the effects of sterilization on the resulting joints and devices Considers the joining, assembly and corrosion performance of medical metals including shape memory alloys, platinum alloys and stainless steel wires Considers the joining and assembly of medical plastics including multiple welding methods, bonding strategies and adhesives

Advanced Adhesives in Electronics

Advanced Adhesives in Electronics
  • Author : M O Alam,C Bailey
  • Publisher :Unknown
  • Release Date :2011-05-25
  • Total pages :280
  • ISBN : 9780857092892
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Summary : Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Nano-Bio- Electronic, Photonic and MEMS Packaging

Nano-Bio- Electronic, Photonic and MEMS Packaging
  • Author : C.P. Wong,Kyoung-Sik Moon,Yi (Grace) Li
  • Publisher :Unknown
  • Release Date :2009-12-23
  • Total pages :761
  • ISBN : 1441900403
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Summary : Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.

Handbook of Manufacturing Engineering and Technology

Handbook of Manufacturing Engineering and Technology
  • Author : Andrew Yeh Ching Nee
  • Publisher :Unknown
  • Release Date :2014-10-31
  • Total pages :3500
  • ISBN : 1447146697
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Summary : The Springer Reference Work Handbook of Manufacturing Engineering and Technology provides overviews and in-depth and authoritative analyses on the basic and cutting-edge manufacturing technologies and sciences across a broad spectrum of areas. These topics are commonly encountered in industries as well as in academia. Manufacturing engineering curricula across universities are now essential topics covered in major universities worldwide.

The Canadian Who's who

The Canadian Who's who
  • Author : Anonim
  • Publisher :Unknown
  • Release Date :1983
  • Total pages :229
  • ISBN : UOM:39015079683747
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Summary :

Micromanufacturing Processes

Micromanufacturing Processes
  • Author : V.K. Jain
  • Publisher :Unknown
  • Release Date :2016-04-19
  • Total pages :429
  • ISBN : 9781439852910
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Summary : Increased demand for and developments in micromanufacturing have created a need for a resource that covers both the science and technology of this rapidly growing area. With contributions from eminent professors and researchers actively engaged in teaching, research, and development, Micromanufacturing Processes details the basic principles, tools,

Nanostructured Soft Matter

Nanostructured Soft Matter
  • Author : A.V. Zvelindovsky
  • Publisher :Unknown
  • Release Date :2007-11-06
  • Total pages :628
  • ISBN : 9781402063305
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Summary : This book provides an interdisciplinary overview of a new and broad class of materials under the unifying name Nanostructured Soft Matter. It covers materials ranging from short amphiphilic molecules to block copolymers, proteins, colloids and their composites, microemulsions and bio-inspired systems such as vesicles.

Materials for Advanced Packaging

Materials for Advanced Packaging
  • Author : Daniel Lu,C.P. Wong
  • Publisher :Unknown
  • Release Date :2016-11-18
  • Total pages :969
  • ISBN : 9783319450988
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Summary : Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Joining Technology of gamma-TiAl Alloys

Joining Technology of gamma-TiAl Alloys
  • Author : Sonia Luisa dos Santos Simoes,Filomena Maria da Conceicao Viana,Manuel Fernando Goncalves Vieira
  • Publisher :Unknown
  • Release Date :2017-07-28
  • Total pages :154
  • ISBN : 9781351647410
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Summary : The book covers the development of new technologies for the joining of TiAl alloys that result in sound bonds obtained in less demanding conditions. It discusses joint processing, microstructural and mechanical characterization, and summarizes developments in new approaches to the joining of TiAl alloys using advanced characterization techniques.

Micro and Precision Manufacturing

Micro and Precision Manufacturing
  • Author : Kapil Gupta
  • Publisher :Unknown
  • Release Date :2017-10-15
  • Total pages :195
  • ISBN : 9783319688015
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Summary : This book provides details on various micro and precision manufacturing and finishing operations performed by conventional and advanced processes, including micro-manufacturing of micro-tools and precision finishing of engineered components. It describes the process mechanism, principles and parameters while performing micro-fabrication and precision finishing operations. The text provides the readers with knowledge of micro and precision manufacturing and encourages them to explore the future venues in this field.

Metasurfaces: Physics and Applications

Metasurfaces: Physics and Applications
  • Author : Sergey I. Bozhevolnyi,Patrice Genevet,Fei Ding
  • Publisher :Unknown
  • Release Date :2018-11-16
  • Total pages :166
  • ISBN : 9783038973447
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Summary : This book is a printed edition of the Special Issue "Metasurfaces: Physics and Applications" that was published in Applied Sciences

Nanoporous Materials and Their Applications

Nanoporous Materials and Their Applications
  • Author : Enrique Rodríguez-Castellón,Sibele Pergher
  • Publisher :Unknown
  • Release Date :2019-05-27
  • Total pages :168
  • ISBN : 9783038979685
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Summary : This book is a special collection of articles dedicated to the preparation and characterization of nanoporous materials, such as zeolitic-type materials, mesoporous silica (SBA-15, MCM-41, and KIT-6), mesoporous metallic oxides, metal–organic framework structures (MOFs), and pillared clays, and their applications in adsorption, catalysis, and separation processes. This book presents a global vision of researchers from international universities, research centers, and industries working with nanoporous materials and shares the latest results on the synthesis and characterization of such materials, which have given rise to the special interest in their applications in basic and industrial processes.

Advanced Manufacturing Technologies

Advanced Manufacturing Technologies
  • Author : Kapil Gupta
  • Publisher :Unknown
  • Release Date :2017-05-28
  • Total pages :294
  • ISBN : 9783319560991
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Summary : This book provides details and collective information on working principle, process mechanism, salient features, and unique applications of various advanced manufacturing techniques and processes belong. The book is divided in three sessions covering modern machining methods, advanced repair and joining techniques and, finally, sustainable manufacturing. The latest trends and research aspects of those fields are highlighted.

Handbook of Laser Welding Technologies

Handbook of Laser Welding Technologies
  • Author : S Katayama
  • Publisher :Unknown
  • Release Date :2013-06-30
  • Total pages :654
  • ISBN : 9780857098771
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Summary : Laser welding is a rapidly developing and versatile technology which has found increasing applications in industry and manufacturing. It allows the precision welding of small and hard-to-reach areas, and is particularly suitable for operation under computer or robotic control. The Handbook of laser welding technologies reviews the latest developments in the field and how they can be used across a variety of applications. Part one provides an introduction to the fundamentals of laser welding before moving on to explore developments in established technologies including CO2 laser welding, disk laser welding and laser micro welding technology. Part two highlights laser welding technologies for various materials including aluminium and titanium alloys, plastics and glass. Part three focuses on developments in emerging laser welding technologies with chapters on the applications of robotics in laser welding and developments in the modelling and simulation of laser and hybrid laser welding. Finally, part four explores the applications of laser welding in the automotive, railway and shipbuilding industries. The Handbook of laser welding technologies is a technical resource for researchers and engineers using laser welding technologies, professionals requiring an understanding of laser welding techniques and academics interested in the field. Provides an introduction to the fundamentals of laser welding including characteristics, welding defects and evolution of laser welding Discusses developments in a number of techniques including disk, conduction and laser micro welding Focusses on technologies for particular materials such as light metal alloys, plastics and glass

Copper Wire Bonding

Copper Wire Bonding
  • Author : Preeti S Chauhan,Anupam Choubey,ZhaoWei Zhong,Michael G Pecht
  • Publisher :Unknown
  • Release Date :2013-09-20
  • Total pages :235
  • ISBN : 9781461457619
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Summary : This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.

Industrial Brazing Practice

Industrial Brazing Practice
  • Author : Philip Roberts
  • Publisher :Unknown
  • Release Date :2003-12-15
  • Total pages :392
  • ISBN : 0203488571
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Summary : Written by an expert with over forty years of experience, this book covers the six rules of brazing and how they impact the various procedures that are an essential part of brazing technology. Exploring what is and what is not good brazing practice, the author presents readers with a reference that will help them deal with the problems they face in

Solidification

Solidification
  • Author : Alicia Esther Ares
  • Publisher :Unknown
  • Release Date :2018-03-14
  • Total pages :162
  • ISBN : 9789535139058
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Summary : Almost all processing of technologically important materials includes a process where liquid material is cooled to form a solid, called "solidification." In order to form a solid from an undercooled melt, the formation of crystalline nuclei and growth of these nuclei to form a solid are necessary. The process of an atom jumping from the liquid to the solid is a diffusive jump with a driving force. The book Solidification is logically developed through a careful presentation of the relevant theories and models of solidification occurring in a variety of materials. Mathematicians, chemists, physicists, and engineers concerned with melting/freezing phenomena will also find this book to be valuable.

Fracture, Fatigue, Failure and Damage Evolution, Volume 7

Fracture, Fatigue, Failure and Damage Evolution, Volume 7
  • Author : Jay Carroll,Shuman Xia,Alison M. Beese,Ryan B. Berke,Garrett J Pataky
  • Publisher :Unknown
  • Release Date :2017-08-24
  • Total pages :127
  • ISBN : 9783319628318
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Summary : Fracture, Fatigue, Failure and Damage Evolution, Volume 7 of the Proceedings of the 2017 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the seventh volume of nine from the Conference, brings together contributions to this important area of research and engineering. Session organizers include: Jay Carroll, Shuman Xia, Allison Beese, Ryan Berke, Garrett Pataky, Samantha Daly, Kavan Hazeli, Antonios Kontsos, Omer Ozgur Capraz, Scott Grutzik, Onome Scott-Emaukpor The collection presents early findings and case studies on a wide range of areas, including: Mechanics of Energy & Energetic Materials Vibration Effects in Fracture & Fatigue Fracture & Fatigue of Additively Manufactured Materials In Situ Techniques for Fatigue & Fracture Microscale & Microstructural Effects on Mechanical Behavior Fracture & Fatigue of Composites Integration & Validation of Models with Experiments Fracture & Fatigue in Extreme Environments Novel Experimental Methods for Fatigue and Fracture Fracture of Brittle & Ductile Materials Interfacial Fracture