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Reflow Soldering Processes and Troubleshooting
- Author : Ning-Cheng Lee
- Publisher :Unknown
- Release Date :2002-01
- Total pages :270
- ISBN : 9780750672184
Summary : Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Reflow Soldering
- Author : Balázs Illés,Oliver Krammer,Attila Geczy
- Publisher :Unknown
- Release Date :2020-07-02
- Total pages :294
- ISBN : 9780128185063
Summary : Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries. Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles Analyses and compares the different reflow ovens Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality Introduces Vapor Phase Soldering (VPS) technology
Soldering Processes and Equipment
- Author : Michael Pecht
- Publisher :Unknown
- Release Date :1993-06-18
- Total pages :312
- ISBN : 047159167X
Summary : Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.
Lead-Free Solder Interconnect Reliability
- Author : Dongkai Shangguan
- Publisher :Unknown
- Release Date :2005
- Total pages :292
- ISBN : 9781615030934
Summary :
FLATPACK REFLOW SOLDERING.
- Author : Anonim
- Publisher :Unknown
- Release Date :1970
- Total pages :229
- ISBN : OCLC:1065866057
Summary :
FLATPACK INSTALLATION BY SINGLE-PROBE REFLOW SOLDERING. Final Report
- Author : Anonim
- Publisher :Unknown
- Release Date :1971
- Total pages :229
- ISBN : OCLC:1065661134
Summary :
Multi-objective Process Optimization for Overpressure Reflow Soldering in Electronics Production
- Author : Alireza Esfandyari
- Publisher :Unknown
- Release Date :2020
- Total pages :229
- ISBN : 3961473838
Summary :
Soldering in Electronics
- Author : R. J. Klein Wassink
- Publisher :Unknown
- Release Date :1989
- Total pages :753
- ISBN : UOM:39015047329803
Summary :
JEE, Journal of Electronic Engineering
- Author : Anonim
- Publisher :Unknown
- Release Date :1995
- Total pages :229
- ISBN : UOM:39015035256455
Summary :
1993 Japan IEMT Symposium
- Author : IEEE Components, Hybrids, and Manufacturing Technology Society,Institute of Electrical and Electronics Engineers
- Publisher :Unknown
- Release Date :1993
- Total pages :396
- ISBN : 0780314328
Summary :
Radio-electronics
- Author : Anonim
- Publisher :Unknown
- Release Date :1987
- Total pages :229
- ISBN : UIUC:30112008085554
Summary :
Transactions of JWRI.
- Author : 大阪大学. 溶接工学研究所
- Publisher :Unknown
- Release Date :2012
- Total pages :229
- ISBN : OSU:32435086526019
Summary :
Surface Mount Technology
- Author : Carmen Capillo
- Publisher :Unknown
- Release Date :1989
- Total pages :347
- ISBN : STANFORD:36105030501162
Summary :
Connectors and Interconnections Handbook
- Author : Anonim
- Publisher :Unknown
- Release Date :1990
- Total pages :229
- ISBN : STANFORD:36105030011360
Summary :
Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment : 2001 IEEE ISEE
- Author : Anonim
- Publisher :Unknown
- Release Date :2001
- Total pages :318
- ISBN : 0780366557
Summary :
Electrical and Electronics Manufacturer
- Author : Anonim
- Publisher :Unknown
- Release Date :1970
- Total pages :229
- ISBN : UIUC:30112106935072
Summary :
Proceedings of the ... International Symposium on Microelectronics
- Author : Anonim
- Publisher :Unknown
- Release Date :1998
- Total pages :229
- ISBN : UOM:39015048109204
Summary :
Proceedings of the 1991 International Symposium on Microelectronics, October 21-23, 1991, Orange County Convention Center, Orlando, Florida
- Author : Anonim
- Publisher :Unknown
- Release Date :1991
- Total pages :555
- ISBN : UCSD:31822018798322
Summary :
Proceedings of the 1987 International Symposium on Microelectronics
- Author : International Society for Hybrid Microelectronics
- Publisher :Unknown
- Release Date :1987
- Total pages :718
- ISBN : UCSD:31822018798330
Summary :
Electronic Packaging and Production
- Author : Anonim
- Publisher :Unknown
- Release Date :1995
- Total pages :229
- ISBN : UIUC:30112039762684
Summary :
NEC Research & Development
- Author : Anonim
- Publisher :Unknown
- Release Date :1999
- Total pages :229
- ISBN : CORNELL:31924083107627
Summary :